F16496
Description
HCU-MF050T Fiber
Numerical Aperture | 0.2 |
---|---|
Attenuation | @ 1300 nm, ≤ 1.0, @ 850 nm, ≤ 2.8 (dB/km) |
Core Diameter | 50 ± 3 (µm) |
ETFE Buffer Diameter | 500 ± 30 (µm) |
Core/Clad Offset | < 3 (µm) |
Cladding Material | Silica |
Buffer Material | ETFE |
Operating Temperature | -65 to +125 (ºC) |
Short-Term Bend Radius | > 10 (mm) |
Long-Term Bend Radius | > 16 (mm) |
Proof Test Level | 150 (kpsi) |
Proof Test Level | 1.03 (GPa) |
Typical Applications | Factory Automation, Short-to-Medium Distance Communications |
Options | Buffer Color, Buffer Diameter, Cabling, Crimp & Cleave Connectorization, Proof Test |
Type | Multimode Graded-Index |
Cladding Diameter | 200 ± 4 (µm) |
Coating Diameter | 230 +0/-10 (µm) |
Coating Material | HCS® |
Bandwidth | @ 1300 nm, ≥ 400, @ 850 nm, ≥ 400 (MHz-km) |
Core/Coating Offset | < 5 (µm) |